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MicroMake from Bright System is an integrated and compact laser micromachining unit for high precision and resolution laser michromachining applications. The system includes all the needed devices for direct laser micro-processing in a single monolithic element. Live microscope imaging of the sample is offered during all process ...
  • Wavelength: 532 nm
  • Working Distance: 39 mm
  • Spatial Resolution: 5 um
  • Processing Area: <= 1 mm^2
  • Max Peak Power: 35 kW
  • ...
Data Sheet
LS4 ACCURATE 3D
Lasea SA
It is a modular and flexible machine
  • Wavelength: N/A nm
  • Working Distance: N/A mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
LS4 ACCURATE
Lasea SA
It is a modular and flexible machine
  • Wavelength: N/A nm
  • Working Distance: N/A mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
LS3 MOTION
Lasea SA
The LS3 is compact, robust, modular and flexible.
  • Wavelength: N/A nm
  • Working Distance: 300 mm
  • Spatial Resolution: N/A um
  • Processing Area: Not Specified
  • Max Peak Power: 0.1 kW
  • ...
Data Sheet
LS3 BASIC
Lasea SA
The LS3 is compact, robust, modular and flexible.
  • Wavelength: N/A nm
  • Working Distance: 200 mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.1 kW
  • ...
Data Sheet
LS2 MOTION
Lasea SA
Designed for the marking of small parts, the LS2 workstation is a class 1 machine for bench mounting. Its robust design (welded mechanical structure) enables operation in the most demanding of environments. It allows for nanosecond or picosecond lasers integration with a simple “plug and play” installation. 
  • Wavelength: N/A nm
  • Working Distance: 350 mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
LS2 BASIC Laser System
Lasea SA
Designed for the marking of small parts, the LS2 workstation is a class 1 machine for bench mounting. Its robust design (welded mechanical structure) enables operation in the most demanding of environments. It allows for nanosecond or picosecond lasers integration with a simple “plug and play” installation.
  • Wavelength: N/A nm
  • Working Distance: 350 mm
  • Spatial Resolution: N/A um
  • Processing Area: Not Specified
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
J Series Ultra-fast Laser Micro-Machining System
Oxford Lasers
Ultra-fast Laser Micro-machining System.      
  • Wavelength: -- nm
  • Working Distance: 50 mm
  • Spatial Resolution: 500 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
Series Dual Beam Laser Micro-Machining System
Oxford Lasers
Dual Beam Laser Micro-machining System.    
  • Wavelength: 1064 nm
  • Working Distance: 50 mm
  • Spatial Resolution: 50 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
E Series Advanced R&D Laser Micro-Machining System
Oxford Lasers
Advanced R&D Laser Micro-machining System.    
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
C Series Robust Full Production System
Oxford Lasers
C Series Robust Full Production System.      
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
A Series Compact Laser Micro-Machining System
Oxford Lasers
Compact Laser Micro-machining System.      
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microFLEX Roll-to-Roll System
3D Micromac
3D-Micromac‘s highly versatile microFLEX™ production platform is the all-in-one solution for the manufacturing of flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. It combines high-precision laser processing with cleaning, coating, printing, and packaging technologies as well as inline ...
  • Wavelength: 351 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microPRO Industrial Laser System
3D Micromac
3D-Micromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. It’s high versatility makes the system perfectly suited for all industrial laser micromachining tasks such as laser structuring, cutting, drilling applications. Furthermore, it is suitable for a variety of substrates, e.g. ...
  • Wavelength: 1070 nm
  • Working Distance: 400 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microSTRUCT C Highly Versatile Laser Micromachining System
3D Micromac
3D-Micromac‘s microSTRUCTTM C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and ...
  • Wavelength: 1064 nm
  • Working Distance: 275 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microCELLTM OTF High-Throughput Laser Processing System
3D Micromac
3D-Micromac‘s microCELLTM OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELLTM OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs, and highest availability. Laser processing ...
  • Wavelength: 1070 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: > 50 mm^2
  • Max Peak Power: -- kW
  • ...
Data Sheet
microPREP High-Throughput Laser Based Microdiagnostics Sample Preparation
3D Micromac
3D-Micromac‘s microPREPTM is the first instrument to enable fast, clean, and efficient laser ablation available for the preparation of samples for microstructure diagnostics and failure analysis. microPREP™ provides key benefits of micromachining using ultrashort pulsed lasers, particularly low structural damage, high power densities ...
  • Wavelength: 1070 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: > 50 mm^2
  • Max Peak Power: -- kW
  • ...
Data Sheet
Sigma Ultra Short Pulse Laser Micromachining System
Amada Miyachi
Amada Miyachi America offers a broad range of laser sources and system platforms for a wide variety of laser micro machining applications including polymer drilling, ceramic processing, and cutting lithium ion battery electrodes. Our in-house applications laboratory is equipped with femtosecond, picosecond, and nanosecond laser ...
  • Wavelength: 1030 nm
  • Working Distance: 100 mm
  • Spatial Resolution: 12 um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 200000 kW
  • ...
Data Sheet
Sigma Laser Micromachining System
Amada Miyachi
Amada Miyachi America offers a broad range of laser sources and system platforms for a wide variety of laser micro machining applications including polymer drilling, ceramic processing, and cutting lithium ion battery electrodes. Our in-house applications laboratory is equipped with femtosecond, picosecond, and nanosecond laser ...
  • Wavelength: 1070 nm
  • Working Distance: 100 mm
  • Spatial Resolution: 12 um
  • Processing Area: Not Specified
  • Max Peak Power: 100 kW
  • ...
Data Sheet
OYSTER Tabletop Laser Machine
Acsys Lasertechnik
This compact system offers an economical entry into laser marking. The table system delivers outstanding results for individual parts and small-scale series for a wide range of different materials. The OYSTER® is used whenever small parts are to be marked or engraved quickly, flexibly and to a high quality standard.
  • Wavelength: 1064 nm
  • Working Distance: 500 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet