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J Series Ultra-fast Laser Micro-Machining System
Oxford Lasers
Ultra-fast Laser Micro-machining System.      
  • Wavelength: -- nm
  • Working Distance: 50 mm
  • Spatial Resolution: 500 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
Series Dual Beam Laser Micro-Machining System
Oxford Lasers
Dual Beam Laser Micro-machining System.    
  • Wavelength: 1064 nm
  • Working Distance: 50 mm
  • Spatial Resolution: 50 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
E Series Advanced R&D Laser Micro-Machining System
Oxford Lasers
Advanced R&D Laser Micro-machining System.    
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
C Series Robust Full Production System
Oxford Lasers
C Series Robust Full Production System.      
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
A Series Compact Laser Micro-Machining System
Oxford Lasers
Compact Laser Micro-machining System.      
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microFLEX Roll-to-Roll System
3D Micromac
3D-Micromac‘s highly versatile microFLEX™ production platform is the all-in-one solution for the manufacturing of flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. It combines high-precision laser processing with cleaning, coating, printing, and packaging technologies as well as inline ...
  • Wavelength: 351 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microPRO Industrial Laser System
3D Micromac
3D-Micromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. It’s high versatility makes the system perfectly suited for all industrial laser micromachining tasks such as laser structuring, cutting, drilling applications. Furthermore, it is suitable for a variety of substrates, e.g. ...
  • Wavelength: 1070 nm
  • Working Distance: 400 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microSTRUCT C Highly Versatile Laser Micromachining System
3D Micromac
3D-Micromac‘s microSTRUCTTM C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and ...
  • Wavelength: 1064 nm
  • Working Distance: 275 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microCELLTM OTF High-Throughput Laser Processing System
3D Micromac
3D-Micromac‘s microCELLTM OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELLTM OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs, and highest availability. Laser processing ...
  • Wavelength: 1070 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: > 50 mm^2
  • Max Peak Power: -- kW
  • ...
Data Sheet
microPREP High-Throughput Laser Based Microdiagnostics Sample Preparation
3D Micromac
3D-Micromac‘s microPREPTM is the first instrument to enable fast, clean, and efficient laser ablation available for the preparation of samples for microstructure diagnostics and failure analysis. microPREP™ provides key benefits of micromachining using ultrashort pulsed lasers, particularly low structural damage, high power densities ...
  • Wavelength: 1070 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: > 50 mm^2
  • Max Peak Power: -- kW
  • ...
Data Sheet
Sigma Ultra Short Pulse Laser Micromachining System
Amada Miyachi
Amada Miyachi America offers a broad range of laser sources and system platforms for a wide variety of laser micro machining applications including polymer drilling, ceramic processing, and cutting lithium ion battery electrodes. Our in-house applications laboratory is equipped with femtosecond, picosecond, and nanosecond laser ...
  • Wavelength: 1030 nm
  • Working Distance: 100 mm
  • Spatial Resolution: 12 um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 200000 kW
  • ...
Data Sheet
Sigma Laser Micromachining System
Amada Miyachi
Amada Miyachi America offers a broad range of laser sources and system platforms for a wide variety of laser micro machining applications including polymer drilling, ceramic processing, and cutting lithium ion battery electrodes. Our in-house applications laboratory is equipped with femtosecond, picosecond, and nanosecond laser ...
  • Wavelength: 1070 nm
  • Working Distance: 100 mm
  • Spatial Resolution: 12 um
  • Processing Area: Not Specified
  • Max Peak Power: 100 kW
  • ...
Data Sheet
OYSTER Tabletop Laser Machine
Acsys Lasertechnik
This compact system offers an economical entry into laser marking. The table system delivers outstanding results for individual parts and small-scale series for a wide range of different materials. The OYSTER® is used whenever small parts are to be marked or engraved quickly, flexibly and to a high quality standard.
  • Wavelength: 1064 nm
  • Working Distance: 500 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
ORCA μ Laser Machining Center
Acsys Lasertechnik
6,5 tons total weight for maximum precision on a processing area of 710 x 710 mm.  The ORCAμ has been specially developed for high-precision applications.The massive, vibration-free granite bed in interaction with the granite Z-axis forms the basis for highest precision in laser processing. The high-precision cross table with ...
  • Wavelength: 1064 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 1 kW
  • ...
Data Sheet
ORCA Laser Machining Center
Acsys Lasertechnik
This large-capacity system by ACSYS offers maximum flexibility with regard to the size and weight of a wide range of very different workpieces. Due to the flexible workspace, even large and heavy workpieces can be loaded easily and marked and/or engraved in any location. The wide-opening doors also allow the loading of ...
  • Wavelength: 1064 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 1 kW
  • ...
Data Sheet
PPI Laser Systems ProVia FP-U
PPI Systems
The ProVia drillers provide the ultimate processing workstation for rigid boards, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UV-only model, a CO2-only model, or the hybrid version with both laser sources. The CO2 laser is appropriate for high speed drilling, cutting ...
  • Wavelength: 10600 nm
  • Working Distance: -- mm
  • Spatial Resolution: 20 um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.02 kW
  • ...
Data Sheet
PPI Laser Systems ProVia FP-C
PPI Systems
The ProVia drillers provide the ultimate processing workstation for rigid boards, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UV-only model, a CO2-only model, or the hybrid version with both laser sources. The CO2 laser is appropriate for high speed drilling, cutting ...
  • Wavelength: 10600 nm
  • Working Distance: -- mm
  • Spatial Resolution: 20 um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.02 kW
  • ...
Data Sheet
PPI Laser Systems ProVia FP-UC
PPI Systems
The ProVia drillers provide the ultimate processing workstation for rigid boards, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UV-only model, a CO2-only model, or the hybrid version with both laser sources. The CO2 laser is appropriate for high speed drilling, cutting ...
  • Wavelength: 10600 nm
  • Working Distance: -- mm
  • Spatial Resolution: 50 um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.02 kW
  • ...
Data Sheet
Laser Micromachining System
PolarOnyx
PolarOnyx FemtoWriter laser micromachining system provides the most flexibility in a single laser micromachining platform. Equipped with high power and high energy femtosecond fiber laser, this system is capable of manufacturing various materials with high precision. The software provides user-friendly interface and intuitive access ...
  • Wavelength: 1064 nm
  • Working Distance: -- mm
  • Spatial Resolution: 2 um
  • Processing Area: > 50 mm^2
  • Max Peak Power: -- kW
  • ...
Data Sheet
Fiber Laser Systems
PhotoMachining
With average powers in excess of 50kW, fiber lasers have taken the heavy industry by storm, for thick metal cutting and welding applications. Additionally, q--swicthed fiber lasers can be found in a number of laser marking systems. The high quality near diffraction limited beam, fiber lasers have found some niche applications in ...
  • Wavelength: 1000 - 2000 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: 50 kW
  • ...
Data Sheet