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MicroMake from Bright System is an integrated and compact laser micromachining unit for high precision and resolution laser michromachining applications. The system includes all the needed devices for direct laser micro-processing in a single monolithic element. Live microscope imaging of the sample is offered during all process ...
  • Wavelength: 266 nm
  • Working Distance: 20 mm
  • Spatial Resolution: 2.2 um
  • Processing Area: <= 1 mm^2
  • Max Peak Power: 0.8 kW
  • ...
Data Sheet
MicroMake from Bright System is an integrated and compact laser micromachining unit for high precision and resolution laser michromachining applications. The system includes all the needed devices for direct laser micro-processing in a single monolithic element. Live microscope imaging of the sample is offered during all process ...
  • Wavelength: 532 nm
  • Working Distance: 39 mm
  • Spatial Resolution: 5 um
  • Processing Area: <= 1 mm^2
  • Max Peak Power: 35 kW
  • ...
Data Sheet
MicroMake from Bright System is an integrated and compact laser micromachining unit for high precision and resolution laser michromachining applications. The system includes all the needed devices for direct laser micro-processing in a single monolithic element. Live microscope imaging of the sample is offered during all process ...
  • Wavelength: 532 nm
  • Working Distance: 39mm mm
  • Spatial Resolution: 4.5 um
  • Processing Area: <= 1 mm^2
  • Max Peak Power: 10 kW
  • ...
Data Sheet
Laser Micromachining | Diode-Pumped Solid-State Applications
SPDLasers
Our sales and applications teams are some of the best in the industry offering our customers experts to help you find the right solution to solve the application problems that are keeping you awake at night. We know that applications development is an important part of the laser buying experience and because of this, we have made ...
  • Wavelength: -- nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
Femtosecond Laser Micromachining Workstation FemtoFAB
Workshop of Photonics
Femtosecond laser micromachining system FemtoFAB is a turnkey laser machine designed for specific industrial process. Configuration is selected and carefully tuned according to a specific laser micromachining application. System is protected by Class 1 equivalent laser safety enclosure and controlled through advanced SCA engineer ...
  • Wavelength: 1028 nm
  • Working Distance: 18.4 mm
  • Spatial Resolution: - um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 1 kW
  • ...
Data Sheet
Laser Micromachining Workstation For Laboratory FemtoLAB
Workshop of Photonics
Laser micromachining workstation for laboratory FemtoLAB is the best solution for scientific laboratories. Equipped with high accuracy linear positioning stages, high performance galvanometer scanners and versatile micromachining software SCA,
  • Wavelength: 1030 nm
  • Working Distance: 17 mm
  • Spatial Resolution: 1 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
LS4 ACCURATE 3D
Lasea SA
It is a modular and flexible machine
  • Wavelength: N/A nm
  • Working Distance: N/A mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
LS4 ACCURATE
Lasea SA
It is a modular and flexible machine
  • Wavelength: N/A nm
  • Working Distance: N/A mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
LS3 MOTION
Lasea SA
The LS3 is compact, robust, modular and flexible.
  • Wavelength: N/A nm
  • Working Distance: 300 mm
  • Spatial Resolution: N/A um
  • Processing Area: Not Specified
  • Max Peak Power: 0.1 kW
  • ...
Data Sheet
LS3 BASIC
Lasea SA
The LS3 is compact, robust, modular and flexible.
  • Wavelength: N/A nm
  • Working Distance: 200 mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.1 kW
  • ...
Data Sheet
LS2 MOTION
Lasea SA
Designed for the marking of small parts, the LS2 workstation is a class 1 machine for bench mounting. Its robust design (welded mechanical structure) enables operation in the most demanding of environments. It allows for nanosecond or picosecond lasers integration with a simple “plug and play” installation. 
  • Wavelength: N/A nm
  • Working Distance: 350 mm
  • Spatial Resolution: N/A um
  • Processing Area: > 50 mm^2
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
LS2 BASIC Laser System
Lasea SA
Designed for the marking of small parts, the LS2 workstation is a class 1 machine for bench mounting. Its robust design (welded mechanical structure) enables operation in the most demanding of environments. It allows for nanosecond or picosecond lasers integration with a simple “plug and play” installation.
  • Wavelength: N/A nm
  • Working Distance: 350 mm
  • Spatial Resolution: N/A um
  • Processing Area: Not Specified
  • Max Peak Power: 0.05 kW
  • ...
Data Sheet
J Series Ultra-fast Laser Micro-Machining System
Oxford Lasers
Ultra-fast Laser Micro-machining System.      
  • Wavelength: -- nm
  • Working Distance: 50 mm
  • Spatial Resolution: 500 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
Series Dual Beam Laser Micro-Machining System
Oxford Lasers
Dual Beam Laser Micro-machining System.    
  • Wavelength: 1064 nm
  • Working Distance: 50 mm
  • Spatial Resolution: 50 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
E Series Advanced R&D Laser Micro-Machining System
Oxford Lasers
Advanced R&D Laser Micro-machining System.    
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
C Series Robust Full Production System
Oxford Lasers
C Series Robust Full Production System.      
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
A Series Compact Laser Micro-Machining System
Oxford Lasers
Compact Laser Micro-machining System.      
  • Wavelength: 1064 nm
  • Working Distance: 150 mm
  • Spatial Resolution: 100 um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microFLEX Roll-to-Roll System
3D Micromac
3D-Micromac‘s highly versatile microFLEX™ production platform is the all-in-one solution for the manufacturing of flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. It combines high-precision laser processing with cleaning, coating, printing, and packaging technologies as well as inline ...
  • Wavelength: 351 nm
  • Working Distance: -- mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microPRO Industrial Laser System
3D Micromac
3D-Micromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. It’s high versatility makes the system perfectly suited for all industrial laser micromachining tasks such as laser structuring, cutting, drilling applications. Furthermore, it is suitable for a variety of substrates, e.g. ...
  • Wavelength: 1070 nm
  • Working Distance: 400 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet
microSTRUCT C Highly Versatile Laser Micromachining System
3D Micromac
3D-Micromac‘s microSTRUCTTM C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and ...
  • Wavelength: 1064 nm
  • Working Distance: 275 mm
  • Spatial Resolution: -- um
  • Processing Area: Not Specified
  • Max Peak Power: -- kW
  • ...
Data Sheet