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Laser Lift-Off Systems

FPD Laser Lift-off System Mother Glass Type Series
DnA Co., Ltd.
Our Laser Lift-Off (LLO) System Series provides precise, high-productivity solutions for flexible display manufacturing by seamlessly separating glass and plastic film. The series is available in two variants: Mother Glass Type and Cell Type. Mother Glass Type Series This series delivers optimal performance in large-format ...

Specifications

Laser Source: DPSS
Wavelength: -- nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
UVblade 250 Laser Lift-Off Processing
Coherent
UVblade gently detaches delicate polymer-based displays of all types from their rigid glass carriers. Laser Lift-Off separation is the enabling technology in manufacturing flexible displays. UVblade is available at variable line beam lengths supporting fast and effective separation of substrates and wafers.

Specifications

Laser Source: DPSS
Wavelength: 308 nm
Laser Output Power: 116 W
Laser Pulse Energy: 580 mJ
Laser Pulse Duration: -- ns
...
Data Sheet
Laser Lift-Off System (Large Workstation)
Philoptics Co.,Ltd.
This is a specialty workstation designed for large scale laser lift-off operations. It utilizes solid state lasers as the source and offers superior productivity and operational throughput. The system utilizes proprietary homogenizing line beam technology.

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
FAMous Laser Lift-Off System
SuperbIN Co. Ltd.
FAMous Laser Lift-Off System is a fully integrated solution that is suitable for cutting thin-film panels, separating delicate PI substrates from glass as well as for glass cutting. It can work with many different materials including:-  Polyimide (PI)-  Polyester (PET)-  Metal Foil-  Organic Film-  ...

Specifications

Laser Source: DPSS
Wavelength: -- nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
Laser Lift-Off System with DPSS Laser
JSW Aktina System Co., Ltd.
Flexible displays have excellent advantages as thin and light, bendable and unbreakable. The Laser Lift-Off (LLO) system detaches a flexible display from a carrier glass substrate without applying stress to it.We select a UV laser of short wavelength that can be absorbed at the only surface of debonding layer, so that laser ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: 800 W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
DFL7560L Laser Lift-Off Machine (DPSS Laser | Wide Homogenized Beam)
DISCO Corporation
Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser.Laser Lift-off is a technology used to detach the material layer from the substrate by irradiating a laser on the material layer formed on the substrate. DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed ...

Specifications

Laser Source: DPSS
Wavelength: -- nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
microMIRA High Throughput Laser Lift-Off System
3D Micromac
3D-Micromac’s brand-new laser LLO system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN 6) and at high processing speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s ...

Specifications

Laser Source: Excimer
Wavelength: 248 nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
VOLCANO 300UV Laser Optics
Innovavent GmbH
The VOLCANO® 300UV Laser Optics is built into a solid granite structure. Two laser beams can be combined to obtain high energy density. The beams are processed by independent telescopes and combined by a specially designed homogenizer. The combined laser beams are homogenized into a 300mm long line beam with a typical width of ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: 300 W
Laser Pulse Energy: 30 mJ
Laser Pulse Duration: 20 ns
...
Data Sheet
VOLCANO 100UV Laser Optics
Innovavent GmbH
The VOLCANO® 100UV Laser Optics is built into a solid granite structure. The beam is homogenized into a 100mm long line beam with a typical width of 20 - 30μm. The FALCON 100UV projection lens assures a uniform line width and the large depth of focus which trouble-free production requires. A single TruMicro 8320 laser (200W, 10 ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: 200 W
Laser Pulse Energy: 20 mJ
Laser Pulse Duration: 20 ns
...
Data Sheet
VOLCANO LB 750UV Laser Optics
Innovavent GmbH
VOLCANO LB 750UV Laser Optics is a Laser Lift-Off system designed with different line lengths of up to 750mm and 1000mm. The use of solid-state lasers emitting UV light at 343nm reduces the operating costs and increases the uptime of production tools remarkably, compared to systems using excimer lasers. The LB systems are based ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: -- W
Laser Pulse Energy: 370 mJ
Laser Pulse Duration: 15 ns
...
Data Sheet

Frequently Asked Questions

Laser lift-off is a laser micromachining technique where thin slices of materials are detached (separated) from a rigid substrate by shining laser beam at the junction interface. The laser beam ablates a microscopic interfacial layer between the slices thus separating – lifting them off.

An LLO system operates by directing a laser beam through a transparent substrate onto a thin film layer. The laser energy is absorbed, causing rapid thermal expansion that triggers the film's separation.

Laser lift-off (LLO) technology is extensively used in microelectronics industry. In particular it is used for separating thin layers of InGaN in LEDs from their sapphire host wafers. They have also found applications in LED and AMOLED display production for detaching polymer layers from glass in flexible displays.

Laser lift-off machines typically employ UV lasers, such as Excimer, frequency doubled DPSS or fiber lasers. Some Laser Lift-Off systems are also outfitted with femtosecond lasers that offer unique light-matter interaction mechanisms.

Several alternatives to laser lift-off do exist including mechanical grinding of the GaN-silicon wafer, followed by chemical processing such as etching, growing hexagonal boron nitride between the layers followed by peeling off the nitride membrane, and electrochemical etching. The downsides of these methods include the degradation of the peeled side of the layer, the difficulty of peel-off, and the difficulty of physical transfer of the layers without damage.

LLO systems are widely used in several industries, including semiconductor manufacturing, flexible display production, and microelectromechanical systems (MEMS) fabrication.

Recent technological advancements in LLO systems include the use of ultrafast lasers for improved precision and speed, as well as enhancements in system automation and control software for increased throughput.

LLO systems provide a clean, efficient method for thin film separation with high precision and repeatability. They are versatile and can process a wide range of materials.

Challenges for LLO systems include thermal stress and the risk of film damage during the lift-off process. Manufacturers are constantly refining laser parameters and system configurations to address these issues.

The future of LLO systems looks promising as demand for thin, flexible electronics continues to rise. They are expected to play a more significant role in the microelectronics and display manufacturing industries.

An Overview of Laser Lift-Off Systems: Optimizing Industrial Efficiency

Introduction

Laser Lift-Off (LLO) systems are becoming increasingly pivotal in microelectronics and display manufacturing industries. LLO technology harnesses the power of lasers to separate thin films from their substrates without causing damage, an indispensable process in modern device fabrication.

Understanding Laser Lift-Off Systems

Laser Lift-Off systems operate by directing a laser beam through a transparent substrate to a thin film layer. The laser energy is absorbed, inducing a rapid thermal expansion that triggers the film's separation. This highly precise, non-contact method mitigates potential material damage, ensuring high yield and product quality.

The LLO process caters to various industries, including semiconductor manufacturing, flexible display production, and microelectromechanical systems (MEMS) fabrication. With the rising demand for thin, flexible electronics, LLO technology plays a crucial role in meeting these market needs.

Technological Advancements in Laser Lift-Off Systems

Recent advancements in LLO technology have improved system performance and output quality significantly. Innovations in laser technology, such as ultrafast lasers, have enhanced the precision and speed of LLO processes. Additionally, advancements in system automation and control software have increased throughput, reducing production costs and time.

These technological strides are driving the adoption of LLO systems, further fueling growth in electronics and semiconductor industries. As device miniaturization continues, the role of sophisticated LLO systems in producing smaller, more efficient components will only expand.

Benefits and Challenges of Laser Lift-Off Systems

The benefits of Laser Lift-Off systems are manifold. They provide a clean, efficient method for thin film separation, offering high precision and repeatability. Additionally, LLO systems are versatile, capable of processing a wide range of materials, from metals and semiconductors to organic compounds.

However, the LLO process is not without its challenges. Issues such as thermal stress and the risk of film damage during lift-off can occur. To address these concerns, system manufacturers continually refine laser parameters and system configurations to optimize performance and minimize potential defects.

Conclusion: Future Prospects of Laser Lift-Off Systems

The future of Laser Lift-Off systems looks promising, with their importance in electronics manufacturing set to increase. As technology trends lean towards thinner, more flexible devices, the demand for efficient LLO systems will continue to rise. With ongoing advancements in laser technology and system engineering, Laser Lift-Off systems are poised to revolutionize the landscape of microelectronics and display manufacturing industries.

In conclusion, Laser Lift-Off systems offer an innovative solution to the complex challenges of thin film separation. Their increasing adoption across various industries underscores their role as a key enabler of the future of device manufacturing.

Did You know?

Laser Lift-Off Systems are specialty laser machines design to detach layers of materials from each other. This process works in situations when the detached layers have different transmission and absorption spectra. During the laser lift-off process a homogenized laser beam (usually in the form of a horizontal beam line) is shined on the substrate containing multiple layers. In order for the process to work the upper layers need to be transparent for the laser radiation while the lower layer should absorb the laser radiation. The transparent upper layer of the substrate allows penetration of the laser beam line into the lower layers which then become ablated due to absorption of the laser radiation. As a result the layers become detached and separated. Laser lift-off systems utilized in opto-electronic / semiconductor applications typically utilize laser radiation in the UV domain (e.g. excimer lasers). For instance, for many polymer based materials used in microelectronics, the absorption is around 100nm. The laser lift-off process is an important manufacturing technique that enables processing extremely fragile materials in very thin layers, such as those utilized in LED and OLED manufacturing.