microMIRA High Throughput Laser Lift-Off System
3D Micromac
3D-Micromac’s brand-new laser LLO system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN 6) and at high processing speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s ...
  • Max Substrate Size: 200 mm
  • Laser Source: Excimer
Data Sheet