microCELLTM TLS High-Throughput Laser System
Description
microCELLTM TLS High-Throughput Laser System
Specifications |
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|---|---|
| Wafer Size: | 300 mm (~12 in) |
| Spindle Rotation Speed: | -- rpm |
| X-Axis Stroke (Cutting Range): | 300 mm |
| X-Axis Speed: | 300 mm/s |
| X-Axis Resolution: | -- um |
| Y-Axis Stroke (Cutting Range): | 300 mm |
| Y-Axis Speed: | 300 mm/sec |
| Y-Axis Resolution: | -- um |
| Z-Axis Stroke: | 300 mm |
| Z-Axis Speed: | 300 mm/sec |
| Z-Axis Resolution: | -- um |
| Materials: | Glass |
| Weight: | kg |
| Electrical Requirements: | Other / Not Specified |
| Max Power Consumption: | ~ 5 kVA |
Features
- On-the-fly laser processing with unbeatable cost-benefit ratio
- One-pass contactless dicing process
- High throughput > 5,000 wph on single lane
- Dicing speed > 300 mm/sec
- Low cost of ownership and CAPEX
- Inline system for complete integration into existing production lines
Applications
- No crystal damage is experienced at the separation edge in the form of the previous usual displacement of resolidified silicon in the ablation areas
- No discharge and no particle formation occurs, as the substrate is only heated and not vaporized
- Higher mechanical stability of processed solar cells
- Routine leaves no residues
- 2D surface (rather 3D topography) causes less recombination
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The benefits of using TLS™ for cell/module production include additional module power output, exceptional mechanical strength of cut cells, avoidance of microcracks, reduced module power degradation, ability to passivate cutting edge, and low cost of ownership.
The suitable wafer sizes for the microCELLTM TLS High-Throughput Laser System are M2 - M12/G12.
The cleavage pattern of the microCELLTM TLS High-Throughput Laser System is half-cells.
The microCELLTM TLS High-Throughput Laser System is a productive laser system for the separation of silicon solar cells into half-cells.
The throughput of the microCELLTM TLS High-Throughput Laser System is up to 6,000 wph.