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microDICE Enabling TLS-DicingTM System
3D Micromac
3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality ...
  • Dicing Material: Silicon, Polymers
  • Dicing Speed: 300 mm/sec
Data Sheet
microCELLTM TLS High-Throughput Laser System
3D Micromac
3D-Micromac‘s microCELLTM TLS is a highly productive laser system for separation of standard silicon solar cells into halfcells. The microCELLTM TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free cleaving process guarantees an outstanding edge quality. Laser processing ...
  • Dicing Material: Silicon, Polymers, Other
  • Dicing Speed: 300 mm/sec
Data Sheet