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microDICE Enabling TLS-DicingTM System
3D Micromac
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This Vendor has not registered with FindLight as a supplier and the information provided might not be up to date,
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3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality ...
Dicing Material:
Silicon, Polymers
Dicing Speed:
300 mm/sec
Data Sheet
microCELLTM TLS High-Throughput Laser System
3D Micromac
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This Vendor has not registered with FindLight as a supplier and the information provided might not be up to date,
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3D-Micromac‘s microCELLTM TLS is a highly productive laser system for separation of standard silicon solar cells into halfcells. The microCELLTM TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free cleaving process guarantees an outstanding edge quality. Laser processing ...
Dicing Material:
Silicon, Polymers, Other
Dicing Speed:
300 mm/sec
Data Sheet
FindLight
3790 El Camino Real, #538,
Palo Alto
,
CA
,
94306
USA
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