FILTER PRODUCTS
Laser Dicing Machines
Frequently Asked Questions
Laser dicing is the process of cutting and removal of individual dies from large wafers. Laser dicing machines utilize near IR radiation to cut out individual dies from larger wafers. In a laser dicing machine laser beam is programmed to trace a contour line around individual dies. The energy deposited from the laser beam is absorbed by the wafer creating smooth cuts along the contour lines. Laser dicing machines also often come with automated die handling mechanism that allow safe handling of the delicate dies without breakage.
In addition to laser dicing, there are other wafer cutting technologies including mechanical sawing, scribing and plasma dicing.
Yes, laser dicing is often referred to as stealth dicing. Please contact us and let us know if you know the origin of the term “stealth dicing”.
Laser dicing is a non-contact procedure that offers smooth cut lines and lacks the debris generated in other cutting methods such as mechanical sawing or scribing. The non-contact nature of the process and the precise control of the laser parameters also mean that the cuts are more precise and throughput is maximized through elimination of scraps. Moreover, cuts made with laser dicing are also characterized with low kerf thus minimizing the waste.
While many regular laser cutters are capable of cutting through wafers, it is not advisable to use them for wafer dicing purposes in large scale projects. This is because they lack the die handling technology to effectively handle the wafers and dies without breakage. Additionally, the laser parameters and the CNC control technology of regular laser cutting machines lack the sophistication and the peculiarities needed for wafer dicing.
Plasma dicing is another technology for separating dies out of wafers. It employs a chemical etching process using fluorine plasma to scribe/etch lines along the contour lines of the dies. Upon scribing the contour lines the dies can be separated from the wafers and handled usually. Plasma dicing is considered a high throughput alternative for wafer dicing.
Did You know?