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Micromachining Lasers

MicroMake from Bright System is an integrated and compact laser micromachining unit for high precision and resolution laser micromachining applications. The system includes all the needed devices for direct laser micro-processing in a single monolithic element.   Live microscope imaging of the sample is offered during all ...

Specifications

Materials: Metals, Thermoset Plastics, Thermoplastics, Polimers, Ceramics, Glass
Laser Type: DPSS (Nd:YAG)
Laser Wavelength: 532 nm (green)
Laser Output Power: -- W
Laser Safety: Not classified
...
Data Sheet
MicroMake-532 from Bright System is an integrated and compact laser micromachining system designed for high precision and resolution laser micromachining applications.    The system includes all the needed devices for direct laser micro-processing in a single monolithic element. Live microscope imaging of the sample is ...

Specifications

Materials: Metals, Thermoset Plastics, Thermoplastics, Polimers, Ceramics, Glass
Laser Type: DPSS (Nd:YAG)
Laser Wavelength: 532 nm (green)
Laser Output Power: -- W
Laser Safety: Not classified
...
Data Sheet
FPD Laser Lift-off System Mother Glass Type Series
DnA Co., Ltd.
Our Laser Lift-Off (LLO) System Series provides precise, high-productivity solutions for flexible display manufacturing by seamlessly separating glass and plastic film. The series is available in two variants: Mother Glass Type and Cell Type. Mother Glass Type Series This series delivers optimal performance in large-format ...

Specifications

Laser Source: DPSS
Wavelength: -- nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
microFLEX Roll-to-Roll Laser Processing Platform
3D Micromac
3D-Micromac‘s highly versatile microFLEX™ production platform is the all-in-one solution for the manufacturing of flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. It combines high-precision laser processing with cleaning, coating, printing, and packaging technologies as well as inline ...

Specifications

Processes: Ablation, Cutting
Materials: Metals, Polimers
Laser Type: Fiber
Laser Safety: Not classified
Work Area X: 300 mm
...
Data Sheet
Delta Laser Machining System
Winbro Group Technologies Ltd
With a choice of four different laser types: high peak power pulsed Nd: YAG, high power CO2, fiber or Q-switched Nd: YAG, the Delta system can be configured for a diverse range of applications including hole drilling, 3D cutting, ablation, welding and cladding. Built upon a substantial, single piece base and with a machine ...

Specifications

Processes: Ablation, Cladding, Cutting, Drilling, Welding
Materials: Metals, Ceramic
Laser Type: CO2, Fiber, DPSS (Nd:YAG)
Laser Safety: Not classified
Work Area X: 1500 mm
...
Data Sheet
LASERDYNE 430 BeamDirector Multipurpose Laser Workstation
Prima Power Laserdyne LLC
The LASERDYNE® 430 workstation was designed for precision laser processing for a wide range of metal and non-metal cutting, welding and drilling applications and it’s the ideal flexible laser machining platform for a wide range of high precision applications. 

Specifications

Processes: Cutting, Drilling, Welding
Materials: Metals, Polimers, Ceramic, Glass
Laser Type: Fiber
Laser Safety: Not classified
Work Area X: 585 mm
...
Data Sheet
LASERDYNE 795 5-Axis Laser Machining System
Prima Power Laserdyne LLC
The LASERDYNE® 795, a 5-axis laser machining system, is designed to drill, weld, and cut medium to large 3D parts with a unique moving beam motion system. Constructed for high-speed operation without compromising mechanical accuracy, it is the first and only standard built multi-axis laser system to guarantee volumetric ...

Specifications

Processes: Cutting, Drilling, Welding
Materials: Metals, Stone, Ceramic
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 1000 mm
...
Data Sheet
Compact Laser Micromachining System RDX 500
Pulsar Photonics GmbH
The RDX 500 is always a good solution when precise and defined micro-machining without compromising on quality is required. Designed as a small-format and compact laser machine, the RDX500 is equipped with high-quality components and a full version of the PhotonicElements machine software.The control technology of the laser system ...

Specifications

Processes: Cutting, Drilling, Scribing, Other
Materials: Metals
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 300 mm
...
Data Sheet
Ultrashort Pulse Compact Laser Processing Workstation (micar C-Baureihe)
Pulsar Photonics GmbH
The C-series is standing for a compact and modular USP laser machine system with multiple and individual adaptions. The configuration extends from the compact stand-alone solution to the complex machine with integrated automation. The standard version has maximum paths of 500 mm in X-/ Y- direction and 400 mm in Z-direction. The ...

Specifications

Processes: Cutting, Drilling, Marking
Materials: Metals, Polimers, Glass
Laser Type: Fiber
Laser Safety: Not classified
Work Area X: 500 mm
...
Data Sheet
Laser Micro Processing System - RDX1000 FBS
Pulsar Photonics GmbH
The laser machine RDX1000 FBS expands the portfolio of Pulsar Photonics‘ RDX series with a system that fulfills even the highest requirements for laser micro processing. The outstanding property of the laser machine is the integration of a flexible beam shaping head and the use of measurement technology for an increased stability of ...

Specifications

Processes: Cutting, Drilling, Other
Materials: Metals
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 450 mm
...
Data Sheet
ILT 3000 Customizable Laser Processing Workstation
Innovative Laser Technologies LLC
The ILT 3000 is a Class 1 fiber laser processing workstation designed for the medical device and aerospace industries and configurable for high-precision welding, cutting and drilling applications. The large, enclosed workstation can incorporate automated part handling and support multiple laser processes if required. Industry ...

Specifications

Processes: Cutting, Welding, Other
Materials: Metals
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 500 mm
...
Data Sheet
4-Axis Compact Laser Processing Workcell
Innovative Laser Technologies LLC
IPG’s 4-Axis Compact Workcell is a highly cost-efficient tool for processing smaller size metal components and enclosures. The high pulse energy and high peak power of the QCW laser enables cutting and drilling of a wide range of material types including steel, aluminum and alloys. The Compact Workcell’s rugged industrial ...

Specifications

Processes: Cutting, Drilling, Welding
Materials: Metals, Thermoplastics, Polimers, Ceramic, Glass
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 250 mm
...
Data Sheet
ST1000 Multi-Axis Workstation
Preco Inc
The Preco ST Series Laser machines come with Preco\'s user-friendly AcuNav® user interface and are designed for multi-axis laser welding, heat treating, cladding, drilling and cutting of metallic components. The ST1000 line incorporates a moving beam design to operate over a two-position index table for high-production ...

Specifications

Processes: Cutting, Drilling, Welding
Materials: Metals
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 300 mm
...
Data Sheet
ST2000 Multi-Axis Workstation
Preco Inc
The Preco ST Series Laser machines come with Preco\'s user-friendly AcuNav® user interface and are designed for multi-axis laser welding, heat treating, cladding, drilling and cutting of metallic components. The ST1000 line incorporates a moving beam design to operate over a two-position index table for high-production ...

Specifications

Processes: Cutting, Drilling, Welding
Materials: Metals
Laser Type: Fiber
Laser Safety: Class 1
Work Area X: 300 mm
...
Data Sheet
ST2400 Multi-Axis Workstation
Preco Inc
The Preco ST Series Laser machines come with Preco's user-friendly AcuNav® user interface and are designed for multi-axis laser welding, heat treating, cladding, drilling and cutting of metallic components. The ST1000 line incorporates a moving beam design to operate over a two-position index table for high-production ...

Specifications

Processes: Cladding, Cutting, Drilling, Welding
Materials: Metals
Laser Type: Fiber
Laser Safety: Class 1M
Work Area X: 1000 mm
...
Data Sheet
UVblade 250 Laser Lift-Off Processing
Coherent
UVblade gently detaches delicate polymer-based displays of all types from their rigid glass carriers. Laser Lift-Off separation is the enabling technology in manufacturing flexible displays. UVblade is available at variable line beam lengths supporting fast and effective separation of substrates and wafers.

Specifications

Laser Source: DPSS
Wavelength: 308 nm
Laser Output Power: 116 W
Laser Pulse Energy: 580 mJ
Laser Pulse Duration: -- ns
...
Data Sheet
Laser Lift-Off System (Large Workstation)
Philoptics Co.,Ltd.
This is a specialty workstation designed for large scale laser lift-off operations. It utilizes solid state lasers as the source and offers superior productivity and operational throughput. The system utilizes proprietary homogenizing line beam technology.

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
FAMous Laser Lift-Off System
SuperbIN Co. Ltd.
FAMous Laser Lift-Off System is a fully integrated solution that is suitable for cutting thin-film panels, separating delicate PI substrates from glass as well as for glass cutting. It can work with many different materials including:-  Polyimide (PI)-  Polyester (PET)-  Metal Foil-  Organic Film-  ...

Specifications

Laser Source: DPSS
Wavelength: -- nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
Laser Lift-Off System with DPSS Laser
JSW Aktina System Co., Ltd.
Flexible displays have excellent advantages as thin and light, bendable and unbreakable. The Laser Lift-Off (LLO) system detaches a flexible display from a carrier glass substrate without applying stress to it.We select a UV laser of short wavelength that can be absorbed at the only surface of debonding layer, so that laser ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: 800 W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
DFL7560L Laser Lift-Off Machine (DPSS Laser | Wide Homogenized Beam)
DISCO Corporation
Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser.Laser Lift-off is a technology used to detach the material layer from the substrate by irradiating a laser on the material layer formed on the substrate. DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed ...

Specifications

Laser Source: DPSS
Wavelength: -- nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
microMIRA High Throughput Laser Lift-Off System
3D Micromac
3D-Micromac’s brand-new laser LLO system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN 6) and at high processing speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s ...

Specifications

Laser Source: Excimer
Wavelength: 248 nm
Laser Output Power: -- W
Laser Pulse Energy: -- mJ
Laser Pulse Duration: -- ns
...
Data Sheet
VOLCANO 300UV Laser Optics
Innovavent GmbH
The VOLCANO® 300UV Laser Optics is built into a solid granite structure. Two laser beams can be combined to obtain high energy density. The beams are processed by independent telescopes and combined by a specially designed homogenizer. The combined laser beams are homogenized into a 300mm long line beam with a typical width of ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: 300 W
Laser Pulse Energy: 30 mJ
Laser Pulse Duration: 20 ns
...
Data Sheet
VOLCANO 100UV Laser Optics
Innovavent GmbH
The VOLCANO® 100UV Laser Optics is built into a solid granite structure. The beam is homogenized into a 100mm long line beam with a typical width of 20 - 30μm. The FALCON 100UV projection lens assures a uniform line width and the large depth of focus which trouble-free production requires. A single TruMicro 8320 laser (200W, 10 ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: 200 W
Laser Pulse Energy: 20 mJ
Laser Pulse Duration: 20 ns
...
Data Sheet
VOLCANO LB 750UV Laser Optics
Innovavent GmbH
VOLCANO LB 750UV Laser Optics is a Laser Lift-Off system designed with different line lengths of up to 750mm and 1000mm. The use of solid-state lasers emitting UV light at 343nm reduces the operating costs and increases the uptime of production tools remarkably, compared to systems using excimer lasers. The LB systems are based ...

Specifications

Laser Source: DPSS
Wavelength: 343 nm
Laser Output Power: -- W
Laser Pulse Energy: 370 mJ
Laser Pulse Duration: 15 ns
...
Data Sheet
Micromachining Laser Machine
ES Laser
This micromachining laser workstation answers all the micro-engineering requirements: it is able to process in 2D or 3D with optimal accuracy and ensures an irreproachable work quality. Fully customizable, our technical team can install all the laser sources and the options needed to your process.

Specifications

Materials: Metals, Thermoset Plastics, Thermoplastics, Polimers, Textile, Wood, Paper, Stones, Ceramics, Glass
Laser Type: Other / Not specified
Laser Wavelength: Other / Non-Specified
Laser Output Power: -- W
Laser Safety: Class 1
...
Data Sheet

Frequently Asked Questions

A micromachining laser is a type of laser that is designed for precision material processing at the micro- and nano-scale level. These lasers typically use short pulse durations and high peak power to remove material with minimal heat affected zone.

Micromachining lasers are used in a wide range of applications, including microelectronics, medical device manufacturing, aerospace, automotive, and more. They can be used for cutting, drilling, scribing, marking, and welding various materials, including metals, ceramics, polymers, and composites.

There are several types of micromachining lasers available, including femtosecond lasers, picosecond lasers, and nanosecond lasers. Femtosecond lasers are the most commonly used for micromachining due to their high precision and minimal heat affected zone.

When selecting a micromachining laser, several factors should be considered, including the material to be processed, the desired precision and speed, the required laser power and pulse duration, and the available budget.

Micromachining lasers offer several advantages for material processing, including high precision, minimal heat affected zone, minimal material waste, and the ability to process a wide range of materials. They can also be used for complex shapes and patterns that may be difficult or impossible to achieve with traditional machining methods.

Some common challenges associated with micromachining lasers include managing heat accumulation, optimizing laser parameters for specific materials, and ensuring consistent quality over large production runs. Additionally, micromachining lasers can be expensive to purchase and maintain, so cost considerations should also be taken into account when selecting a micromachining laser.

Micromachining lasers can be used to process a wide variety of materials, including metals, ceramics, polymers, and composites. The specific materials that can be micromachined depend on factors such as the wavelength and power of the laser, as well as the properties of the material itself.

Micromachining refers to the fabrication of microscale features and structures, typically on the order of 1-100 micrometers in size. Nanomachining, on the other hand, involves the fabrication of structures on the nanoscale, typically less than 100 nanometers in size.

FindLight.net offers a wide selection of Micromachining Lasers from 200+ suppliers worldwide. Browse and compare Laser Micromachining Systems, Laser Lift-Off Machines, and more for your precision microfabrication needs. Get free quotes and contact suppliers directly with one click. Find the perfect Micromachining Laser for your application on FindLight.net.

Did You know?

Micromachining lasers are powerful tools used to create tiny structures and features on a wide range of materials, including metals, ceramics, polymers, and composites. These lasers use high-energy pulses of light to precisely ablate or vaporize material, allowing for extremely precise and accurate machining. Micromachining lasers are commonly used in microelectronics, medical device manufacturing, aerospace, and automotive industries to create microscale features such as channels, holes, and textures. When selecting a micromachining laser, it's important to consider factors such as the laser wavelength, power output, pulse duration, and repetition rate, as well as the specific application requirements. With their high precision and versatility, micromachining lasers are an essential tool for many modern manufacturing processes. In microelectronics, for example, micromachining lasers are used to create channels and vias on printed circuit boards and microchips. In medical device manufacturing, they can be used to produce precise features on implantable devices or microfluidic channels for drug delivery. In aerospace and automotive industries, micromachining lasers can be used to create precision components such as turbine blades or fuel injectors.