UV Laser Marking Machine MY-UV03
Description
UV Laser Marking Machine MY-UV03
Specifications |
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|---|---|
| Work Area X: | 150 mm |
| Work Area Y: | 150 mm |
| Beam Delivery: | Galvo |
| Laser Source: | Fiber |
| Laser Output Power: | 3 W |
| Laser Wavelength: | 355 nm (UV) |
| Marking Speed: | 7000 mm/sec |
| Voltage Requirement: | Other / Not Specified |
| Materials: | Stainless Steel, Steel/Iron, Steel Alloy, Aluminum, Anodized Aluminum, Brass, Copper, Gold, Silver, Nickel, Titanium, Platinum, Glass, Plastic, Paper, Acrylic, Plexiglass |
| Air Assist: | Not Specified |
| Fume Extraction Unit: | Not specified |
| Safety Enclosure: | Not Included |
| Working Area: | 150*150 mm |
| Beam Quality: | M2 <1.1 |
| Pulse Width: | 10 - 50 ns |
| Focus Spot Diameter: | <0.01 mm |
| Operation Environment: | 15-35 ℃ |
| Lifespan Of UV Laser Source: | Max to 20 000 hours |
Features
- High-quality laser beam, small-size spot, can do super precise marking/engraving.
- Short UV wavelength 355nm reduces heat effect on work piece.
- Precise marking effect and available repeatable marking.
- High precision scanning galvanometer laser head.
- Extraordinary fine spot guarantees perfect marking performance.
- Heat affected area is very small, no heating effect, material will not be burned or deformed.
- High marking speed, high efficiency.
- Stable performance, small size, low power consumption.
Applications
- Handcrafted products, medicine, cosmetics, polymer materials including packaging and bottles. The resulting marks are very precise and can withstand wear and tear better than those created by ink printing.
- Marking of flexible PCBs, silicon and wafer micro hole drilling, blind hole processing.
- LCD glass QR code marking, glass ware punching, metal surface coating marking, plastic buttons, communications equipment, electronics, gifts, building materials and so on.
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
since 2015
Frequently Asked Questions
The UV Laser Marking Machine has a short UV wavelength of 355nm.
The UV Laser Marking Machine is particularly suitable for food, pharmaceutical packaging material marking, micro porous, high-speed dividing for glass, complex graphics wafer cutting on silicon materials, and materials greatly affected by thermal radiation.
The UV Laser Marking Machine features a high-quality laser beam, small-size spot, super precise marking/engraving, precise marking effect, high precision scanning galvanometer laser head, extraordinary fine spot, small heat affected area, high marking speed, high efficiency, stable performance, small size, and low power consumption.
The UV Laser Marking Machine is mainly used in precision marking of products in high-end markets such as handcrafted products, medicine, cosmetics, polymer materials including packaging and bottles, flexible PCBs, silicon and wafer micro hole drilling, blind hole processing, LCD glass QR code marking, glass ware punching, metal surface coating marking, plastic buttons, communications equipment, electronics, gifts, building materials and so on.
Yes, the UV Laser Marking Machine can work within a production line to feed and discharge materials automatically.