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Frequently Asked Questions

The LCS 50 Laser Cutting System features a cylindrical beam resulting in parallel kerfs, smooth cutting surfaces and sharp edges, virtually no heat impact thanks to water jet cooling capability, Finnish cutting of 1.6 mm PCD and cemented carbide in up to 5 mm/min, high mechanical precision with a tolerance of less than +/- 3 μm, very small kerf width (down to 30 μm), clean surfaces and no depositions, no or very little post-treatment required, and no focus control necessary due to long working distance.

The LCS 50 Laser Cutting System includes a high-power green laser, a compact high-pressure water pump with an ultra-pure water unit, a 21.5-inch touch-screen control panel, and a vision system with motorized zoom.

The Laser MicroJet is a hybrid method of machining that combines a laser with a "hair-thin" water jet that precisely guides the laser beam by means of total internal reflection in a manner similar to conventional optical fibers. The water jet continually cools the cutting zone and efficiently removes debris.

The LCS 50 is Synova's most compact and cost-efficient Laser MicroJet (LMJ) machine designed for precision cutting, drilling, grooving, or slicing of industrial diamond tools and other small workpieces.

The LCS 50 can cut super hard materials such as polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), CVD diamond, natural diamond, tungsten carbide (WC), metals such as stainless steel, gold, Durnico, CuBe, copper, brass, aluminum, shape-memory alloys (Nitinol), titanium, nickel, super-alloys, and ceramics such as ceramic-matrix composites (CMCs), silicon carbide (SiC), silicon nitride (SiN), zirconia (ZrO2), HTCC/LTCC, aluminum nitride (AlN), aluminum oxide (Al2O3).

The LCS 50 can perform 2D cutting, drilling, slicing, and grooving with its 3-axis machine and 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, and engraving with its 5-axis machine.

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