LCS 305 Laser Cutting System
Description
The LCS 305 with integrated water jet guided laser technology (Laser MicroJet®) is specifically designed for the automatic production of large and small diamond cutting tools.
The CNC machine with five synchronous axes is characterized by a particularly intelligent machine concept and highly dynamic axes for maximum precision and speed.
The LCS disposes of consistent temperature control with water-cooled linear and torque motors (+/- 0.1°C) and a mineral casting machine bed for more stability and reduced vibrations.
A fully automatic offset calibration system integrates laser-nozzle alignment, automatic jet angle correction, laser power meter and touch probe. Tools can be exchanged with a very high accuracy thanks to the HSK 63 tool holder.
LCS 305 Laser Cutting System
Specifications |
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|---|---|
| Format: | Tower |
| Laser Source: | DPSS (Nd:YAG) |
| Laser Output Power: | 400 W |
| Laser Wavelength: | 532 nm (green) |
| Beam Delivery: | Galvo |
| Work Area X: | 130 mm |
| Work Area Y: | 130 mm |
| Work Area Z: | 260 mm |
| Application: | Sheet Cutting, 3D Cutting |
| Sector: | Industrial, Engineering, Professional |
| Materials: | Stainless Steel, Steel Alloy, Aluminum, Concrete, Granite, Plexiglass, Ceramic |
| Voltage Requirement: | 400V - 50Hz |
| Included Options: | CNC, Laser Chiller |
| Safety Enclosure: | Yes |
| Laser Safety Class: | Other / Not Specified |
| Max Cutting Speed: | 500 mm/s |
Features
- Smooth cutting surfaces and sharp edges (Ra as low as 0.2 μm)
- Cylindrical beam resulting in parallel kerfs (no V-shape)
- Virtually no heat impact thanks to water jet cooling capability
- Finnish cutting of 1.6 mm PCD and cemented carbide in 3 mm/min.
- High mechanical precision with a tolerance of +/- 3 μm
- Very small kerf width (down to 30 μm)
- Clean surfaces and no depositions
- No post treatment required
- No focus control necessary due to long working distance
Applications
- Hard materials: Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), chemical-vapor-deposition (CVD) diamond, natural diamond (ND), tungsten carbide (WC)
- Metals: Super-alloys, stainless steel, aluminum, copper, titanium, nickel etc.
- Ceramics: Ceramic-matrix composites (CMCs), silicon carbide (SiC), silicon nitride (SiN), zirconia (ZrO2), HTCC/LTCC (high temperature and low temperature co-fired ceramic), aluminum nitride (AlN), aluminum oxide (Al2O3)
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Switzerland
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Frequently Asked Questions
The LCS 305 Laser Cutting System has a very small kerf width, down to 30 μm.
The Laser MicroJet® is a hybrid method of machining, which combines a laser with a “hair-thin” water jet that precisely guides the laser beam by means of total internal reflection in a manner similar to conventional optical fibers. The water jet continually cools the cutting zone and efficiently removes debris.
The LCS 305 Laser Cutting System has a high mechanical precision with a tolerance of +/- 3 μm.
The LCS 305 can cut ultra-hard materials such as Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), CVD diamond, natural diamond, tungsten carbide (WC), metals such as superalloys, stainless steel, aluminium, copper, nickel, titanium, and ceramics such as ceramic-matrix composites (CMCs), silicon carbide (SiC), silicon nitride (SiN), zirconia (ZrO2), HTCC/LTCC, aluminium nitride (AlN), aluminium oxide (Al2O3).
The LCS 305 Laser Cutting System can perform 3D cutting and shaping, drilling, slotting, grooving, trenching, milling, slicing, edge grinding (K-land edges, single or multiple clearance angles), engraving, and profiling.