S-1000 Benchtop Sintering System
Description
The XENON S-1000 is a benchtop system for printed electronics that offers high peak energy, pulsed light technology to quickly heat and fuse conductive metallic ink flakes and nano inks at room temperature without significantly heating the substrate or adjacent thermally sensitive components. The compact S-1000 has adjustable exposure intensity ranging from 290-830 joules with three exposure area options; 7.6x7.8cm, 1.9-30cm and 30.5x 30.5cm. System consists of a table top controller, separate lamp housing, UV Sintering chamber and lamp housing air cooling.
S-1000 Benchtop Sintering System
Features
Adjustable exposure density
Exposure area options
Sintering chamber
Room temperature process
Sinter on heat-sensitive materials
Pulse duration 520 us
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Frequently Asked Questions
The compact S-1000 has adjustable exposure intensity ranging from 290-830 joules with three exposure area options; 7.6x7.8cm, 1.9-30cm and 30.5x 30.5cm.
The S-1000 has adjustable exposure density, exposure area options, sintering chamber, room temperature process, sinter on heat-sensitive materials, and pulse duration 520 us.
Three flash lamp housing options are available with optional attached sintering chambers. Selection is based on desired curing area and user adjustable pulse energy range.
The LH-910 spiral lamp housing provides a curing area of 7.6 x 7.6 cm at a distance of 2.5 cm from the lamp housing window. An optional lamp chamber, model LC-915 integrates the LH-910 optical source to provide a light blocking chamber with an adjustable platform to place samples. The height of the sample platform can be user adjusted from 2.5 to 7.5 cm from the lamp housing window. The chamber access door has an interlock to prevent the lamp from flashing when open.
The XENON S-1000 is a benchtop system for printed electronics that offers high peak energy, pulsed light technology to quickly heat and fuse conductive metallic ink flakes and nano inks at room temperature without significantly heating the substrate or adjacent thermally sensitive components.