THERMAL INTERFACE MATERIALS FOR ROBUST LED LIGHTINGS DISPLAYS AND PANELS
Description
THERMAL INTERFACE MATERIALS FOR ROBUST LED LIGHTINGS, DISPLAYS AND PANELS: LED Die-Attach Adhesive, LED Submount Thermal Adhesive, LED Module Mounting Compressible Thermal Interface Phase-Change Pad.
THERMAL INTERFACE MATERIALS FOR ROBUST LED LIGHTINGS DISPLAYS AND PANELS
Features
LED Die-Attach Adhesive with proven high Thermal Conductivity and Low Thermal Interface Resistance
LED Submount and LED Module mounting Thermal Film Adhesive with Instant Melt-Bonding
Compressible, Conformal Phase-Change Thermal Interface Pad for LED Heat-Sink
Insulated Metal Thermal Substrate for Metal-Core Printed Wiring Board (MCPCB) with 2X Thermally Conductivity for LED Submout and LED Module
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United States
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Frequently Asked Questions
The thermal interface materials are used for robust LED lightings, displays, and panels.
The LED Die-Attach Adhesive has proven high thermal conductivity and low thermal interface resistance.
The purpose of the LED Submount and LED Module mounting Thermal Film Adhesive is instant melt-bonding.
The Compressible, Conformal Phase-Change Thermal Interface Pad is used for LED heat-sink.
The Insulated Metal Thermal Substrate for Metal-Core Printed Wiring Board (MCPCB) has 2X thermally conductivity for LED submount and LED module.